TDA2170 tv vertical deflection output circuit december 1992 11 10 9 8 7 6 5 4 3 2 1 tab connected to pin 6 nc gnd reference voltage output stage supply output gnd flyback generator supply voltage non inverting input inverting input nc 2170-01.eps pin connections multiwatt 11 (plastic package) order code : TDA2170 the functions incorporated are : . power amplifier . flyback generator . reference voltage . thermal protection description the TDA2170 is a monolithic integrated circuit in 11-lead multiwatt ? package. it is a high efficiency power booster for direct driving of vertical windings of tv yokes. it is intended for use in colour are b & w television receivers as well as in monitors and displays. 1/7
thermal protect ion 5 8 4 2 3 7 6 yoke +v s power amplif ier 10 9 reference volt age fly back generator 2170-02.eps block diagram q11 q12 d4 d5 r5 r4 q10 d3 q9 d6 d7 q14 q13 q15 r7 r6 q7 q6 q8 r3 c2 q4 c1 q1 q2 q5 q3 r2 d2 r1 r14 q26 r17 r18 q27 r12 q29 q28 z2 d1 r16 r13 q24 q25 q23 z1 r15 2 3 6 10 9 q16 r8 r9 q19 d8 q17 q18 q22 r11 q20 d9 r12 q21 7 4 8 5 2170-03.eps schematic diagram TDA2170 2/7
absolute maximum ratings symbol parameter value unit v s supply voltage (pin 4) 35 v v 7 ,v 8 flyback peak voltage 60 v v 5 voltage at pin 5 + v s v 2 ,v 3 amplifier input voltage + v s 0.5 v i o output peak current (non repetitive, t = 2 msec) 2.5 a i o output peak current at f = 50 hz, t 10 m sec 3a i o output peak current at f = 50 hz, t > 10 m sec 2a i 5 pin 5 dc current at v 7 TDA2170 3/7
figure 1 : dc test circuits 2170-04.eps s 1 : (a) i 2 ; (b) i 3 ,i 4 and i 8 . s 2 : (a) i 4 and i 8 ; (b) i 3 ; (c) i 2 . s 3 : (a) i 2 ,i 3 ,i 4 ,i 8 ,i 9 and v 9 ; (b) r9. figure 1a : measurement of i 2 ;i 3 ;i 4 ;i 8 ;i 9 ; d v 9 / d v s ;r9 2170-05.eps figure 1b : measurement of v7 h 2170-06.eps s1 : (a) v 5l ; (b) v 7l . figure 1c : measurement of v 5l ,v 7.l . 2170-07.eps figure 1d : measurement of v 7 . 2170-08.eps figure 2 : application circuit TDA2170 4/7
components list for typical applications component 110 tvc 5.9 w /10mh 1.95 app 110 tvc 9.6 w / 24.6 mh 1.2 app 90 tvc 15 w /30mh 0.82 app unit rt1 10 4.7 10 k w r1 12 10 12 k w r2 10 5.6 5.6 k w r3 27 12 18 k w r4 12 8.2 5.6 k w r5 0.82 1 1 w r6 270 330 330 w r7 1.5 1.5 1.5 w d1 1n 4001 1n 4001 1n 4001 c1 0.1 0.1 0.1 m f c2 el. 1000/25 v 470/25 v 470/25 v m f c3 el. 220/25 v 220/25 v 220/25 v m f c4 0.22 0.22 0.22 m f c5 el. 2200/25 v 2200/25 v 1000/16 v m f c6 el. 4.7/16 v 4.7/16 v 10/16 v m f 2170-04.tbl 2170-09.tif figure 3 : pc board and component layout (1:1 scale) TDA2170 5/7
typical performances parameter 110 tvc 5.9 w /10mh 110 tvc 9.6 w /27mh 90 tvc 15 w /30 mh unit v s supply voltage 24 22.5 25 v i s current 280 175 125 ma t fly flyback time 0.6 1 0.7 ms *p tot power dissipation 4.2 2.5 2.05 w *r th ca heatsink 7 13 16 c/w t amb 60 60 60 c t j max 110 110 110 c t o 20 20 20 ms v i 2.5 2.5 2.5 v pp v 7 50 47 52 v p 2170-05.tbl * worst case condition. mounting instructions the power dissipated in the circuit must be re- moved by adding an external heatsink. thanks to the multiwatt ? package attaching the heatsink is very simple, a screw or a compres- sion spring (clip) being sufficient. between the heatsink and the package it is better to insert a layer of silicon grease, to optimize the thermal contact ; no electrical isolation is needed between the two surfaces. 2170-10.eps / 2170-11.eps figure 2 : application circuit 2170-12.eps figure 5 : maximum allowable power dissipation versus ambient temperature TDA2170 6/7
f g g1 l l1 l7 s h1 l3 s1 l4 h2 dia. 1 a m c d m1 e b l2 pmmul11v.eps package mechanical data 11 pins - plastic multiwatt dimensions millimeters inches min. typ. max. min. typ. max. a 5 0.197 b 2.65 0.104 c 1.6 0.063 e 0.49 0.55 0.019 0.022 f 0.88 0.95 0.035 0.037 g 1.57 1.7 1.83 0.062 0.067 0.072 g1 16.87 17 17.13 0.664 0.669 0.674 h1 19.6 0.772 h2 20.2 0.795 l 21.5 22.3 0.846 0.878 l1 21.4 22.2 0.843 0.874 l2 17.4 18.1 0.685 0.713 l3 17.25 17.5 17.75 0.679 0.689 0.699 l4 10.3 10.7 10.9 0.406 0.421 0.429 l7 2.65 2.9 0.104 0.114 m 4.1 4.3 4.5 0.161 0.169 0.177 m1 4.88 5.08 5.3 0.192 0.200 0.209 s 1.9 2.6 0.075 0.102 s1 1.9 2.6 0.075 0.102 dia. 1 3.65 3.85 0.144 0.152 mul11v.tbl information furnished is believed to be accurate and reliable. however, sgs-thomson microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no licence is granted by implication or otherwise under any patent or patent rights of sgs-thomson microelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. sgs-thomson microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of sgs-thomson microelectronics. ? 1994 sgs-thomson microelectronics - all rights reserved purchase of i 2 c components of sgs-thomson microelectronics, conveys a license under the philips i 2 c patent. rights to use these components in a i 2 c system, is granted provided that the system conforms to the i 2 c standard specifications as defined by philips. sgs-thomson microelectronics group of companies australia - brazil - china - france - germany - hong kong - italy - japan - korea - malaysia - malta - morocco the netherlands - singapore - spain - sweden - switzerland - taiwan - thailand - united kingdom - u.s.a. TDA2170 7/7
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